Μετάφραση και ανάλυση λέξεων από την τεχνητή νοημοσύνη ChatGPT
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Τι (ποιος) είναι flip chip - ορισμός
@Zen2@Rome@EPYC 7702 ES@2S1404E2VJUG5 BB ES DSCx6 IOD top metal@5x.jpg?width=200 "Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible")
![From a DEC [[KA10]], holding nine transistors, 1971](https://commons.wikimedia.org/wiki/Special:FilePath/KA10 mod top.jpg?width=200 "From a DEC [[KA10]], holding nine transistors, 1971")
![inverters]], each built from one [[transistor]], two [[diode]]s, and a [[hybrid integrated circuit]] built using [[flip chip]] technology.](https://commons.wikimedia.org/wiki/Special:FilePath/R107FlipChipTop.JPG?width=200 "inverters]], each built from one [[transistor]], two [[diode]]s, and a [[hybrid integrated circuit]] built using [[flip chip]] technology.")
![DEC [[PDP-8/E]] minicomputer, built from multiple quad-height M-series modules](https://commons.wikimedia.org/wiki/Special:FilePath/PDP-8e, inside.jpg?width=200 "DEC [[PDP-8/E]] minicomputer, built from multiple quad-height M-series modules")
Βικιπαίδεια
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
